[Core News] Intel wafer foundry encounters obstacles, Qualcomm expands AI PC chip series
1. Intel’s 18A process failed Broadcom’s test, causing a setback for its foundry business
According to people familiar with the matter, Broadcom completes Intel's
18A advanced processAfter evaluation, it was determined that the process did not meet the conditions for mass production, and the potential OEM cooperation between the two parties was questionable.
Intel responded that the 18A process yield and production capacity are performing well, and the mass production plan remains unchanged; Broadcom said that the evaluation is still ongoing and no final conclusion has been given, and the development of Intel's wafer foundry business has encountered obstacles again.
2. Intel concentrates resources on 18A and outsources Arrow Lake processor manufacturing
Intel announced that it would adjust its advanced process layout and shift its 20A node engineering resources to the 18A process, relying on RibbonFET GAA transistors and PowerVia backside power supply core technologies to ensure the commercialization of 18A.
Affected by adjustments to production capacity and process strategies,
Arrow LakeThe series of processors will be produced by external OEMs, with only Intel’s internal packaging retained, marking a further intensification of Intel’s trend of outsourcing high-end CPUs.
3. Qualcomm increases focus on AI PCs and launches Snapdragon X Plus 8-core platform
Qualcomm continues to expand its Snapdragon X series AI PC chip lineup and releases new
Snapdragon X Plus 8-core processor, accurately covering the mid-range Copilot+PC market of US$700–900.
Equipped with a customized Oryon CPU and built-in 45 TOPS high computing power NPU, the device-side AI capabilities are greatly improved, taking into account low power consumption and long battery life; the product has been adopted by Acer, ASUS, Dell, Lenovo, Samsung and other complete machine manufacturers, accelerating the popularization of device-side AI.
4. Global semiconductor sales have grown steadily, with a year-on-year increase of 18.7% in July
SIA released data that in July 2024, global semiconductor sales reached
$51.3 billion, a year-on-year increase of 18.7% and a month-on-month increase of 2.7%. The industry recovery trend is solid.
Regional performance is differentiated: the Americas, mainland China, and other Asia-Pacific regions have experienced significant year-on-year growth; the European and Japanese markets have been under pressure year-on-year, and the overall demand structure has obvious differences.
5. World's most advanced ×NXP establishes joint venture wafer fab, focusing on automotive-grade analog chips
World Advanced and NXP joint venture established
VisionPower（VSMC）, completed capital injection and approval, and the 300mm wafer fab is about to start construction.
The factory is expected to enter mass production in 2027, focusing on 130nm–40nm mixed-signal, power management, and automotive-grade analog devices. The technology is licensed by TSMC. It plans to have a monthly production capacity of 55,000 pieces in 2029, targeting the automotive, industrial, and consumer electronics markets.
6. Power Semiconductor’s 3D stack & 2.5D interposer technology wins orders from major AI manufacturers
Power Semiconductor Manufacturing Co., Ltd.’s Logic-DRAM 3D wafer stacking technology has been adopted by companies such as AMD. It combines advanced logic technology to create low-cost, low-power AI chip solutions that meet the needs of large models and AI PCs.
The 2.5D high-density interposer product for GPU+HBM scenarios has completed major manufacturer certification and will be introduced into mass production at the new factory, entering the AI advanced packaging track.
7. ASE: Demand for AI packaging explodes, production capacity delivery is tight
ASE, the world's leader in packaging and testing, said that the current demand for AI chip packaging is extremely strong, with full orders, shortage of production capacity, and outstanding delivery pressure.
The development logic of the industry has changed. A single manufacturing link can no longer meet the needs of AI. It requires the collaboration of the entire industry chain of wafers, packaging, materials, and systems, and multiple solutions to work together to solve the problem of mass production of computing power hardware.
8. Toshiba releases a new car-standard interface chip to simplify vehicle electronic control design
Toshiba launches automotive-grade interface chip that complies with CXPI automotive communication protocol
TB9033FTG, meets AEC-Q100 standard, operating temperature - 40℃~125℃.
Integrating multiple GPIO, ADC, PWM and fault detection circuits can simplify the vehicle wiring harness, reduce the weight of the vehicle body, and is widely adapted to scenarios such as body control and vehicle-mounted intelligent terminals.
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