[Core Information] Nvidia’s revenue doubled, Micron acquired panel factory to develop packaging

1. Nvidia's performance surges sharply, data center business becomes core pillar

   Nvidia's financial report for the second quarter of fiscal year 2025 was eye-catching, with single-quarter revenue of US$30.04 billion, a year-on-year increase of 122% and a month-on-month increase of 15%; net profit was US$16.6 billion, a year-on-year increase of 168%; gross profit margin reached 75.1%, a year-on-year increase of 5 percentage points.

   Breaking down the business, data center revenue was US$26.3 billion, accounting for 88%, a year-on-year surge of 154%; gaming and automotive businesses grew steadily.The company expects third-quarter revenue of US$32.5 billion, and demand for AI computing power continues to be high.
2. Micron acquires Tainan factory to expand wafer testing and packaging capacity

   Micron spent NT$7.4 billion to acquire two Tainan plants and land from AU Optronics, which will be transformed into front-end wafer testing bases to support the expansion of DRAM production capacity at the Taichung and Taoyuan plants and strengthen memory chip manufacturing and packaging and testing capabilities.
3. Qualcomm acquires Sequans 4G IoT technology to strengthen industrial IoT layout

   Qualcomm completed the acquisition of Sequans' 4G IoT core technology, assets and team to improve the cellular IoT product matrix.With the help of 4G communication technology accumulation, we will strengthen the industrial Internet of Things and wide-area low-power networking solutions to expand the competitiveness of the Internet of Things track.
4. SK Hynix launches world premiere of sixth-generation 10nm DDR5, significantly reducing costs and increasing efficiency

   SK Hynix successfully mass-produced the world's first sixth-generation 1c process 16Gb DDR5 DRAM, optimizing the EUV process and new material application, increasing production efficiency by more than 30%.

   The memory speed reaches 8Gbps and the energy efficiency is increased by 9%. It is mainly used in AI data center scenarios, which can help cloud customers significantly reduce energy consumption and electricity expenses, and adapt to high-density computing clusters.
5. TI launches ultra-small 4K DLP display controller, adapted for micro-projection

   Texas Instruments has released the DLPC8445 ultra-small display controller, measuring only 9mm × 9mm. With matching DMD and power management chips, it can achieve low-power, high-speed 4K ultra-clear display. It is widely used in micro-projectors and portable display devices. Sample procurement is now open.
6. ON Semiconductor releases silicon-carbon hybrid power module, suitable for photovoltaics and energy storage

   ON Semiconductor's new F5BP packaged hybrid power integrated module combines silicon IGBTs and silicon carbide diodes to fully upgrade the power density and conversion efficiency. It can increase the power of photovoltaic string inverters from 300kW to 350kW, reduce switching losses, improve system reliability, and focus on new energy storage and photovoltaic power station scenarios.
7. TDK expands production of automotive-grade high-current inductors, targeting automotive high-voltage and industrial power supplies

   TDK has upgraded and expanded the ERU27M series of flat wire inductors to meet the high current and high power density requirements of automobiles and industry, and comply with AEC-Q200 automotive standards.The product has low DC resistance and operates in a wide temperature range, and is widely used in vehicle-mounted DC-DC, VRM modules, and new energy inverter equipment.
8. ROHM's fourth-generation SiC MOSFET is put into mass production and is equipped with Ji Krypton's main models

   ROHM's fourth-generation silicon carbide MOSFET power modules have been fully equipped with on-board inverters for the three main models of JiKrypton X, 001 and 009.The two parties have long-term and in-depth cooperation in SiC technology. Rohm continues to iterate product routes and plans to launch fifth-generation devices in 2025 to accelerate the large-scale popularization of automotive silicon carbide.