[Core Information] ON Semiconductor's revenue fell year-on-year, and NAND flash memory investment declined instead of increasing
1. ON Semiconductor’s Q2 revenue fell 17.2% year-on-year to US$1.735 billion
ON Semiconductor released its financial report for the second quarter of 2024, achieving revenue of US$1.735 billion, a year-on-year decrease of 17.2%; GAAP gross profit margin was 45.2%, a year-on-year decrease of 2.2 percentage points; net profit attributable to shareholders was US$338 million, a significant year-on-year decrease of 41.3%.End-of-quarter inventories were US$2.225 billion, continuing to rise quarter-on-quarter.
Business segments are under pressure across the board: the power solution department’s revenue is US$835 million, down 15% year-on-year; the analog and mixed-signal department’s revenue is US$648 million, down 18% year-on-year; the intelligent sensing department’s revenue is US$252 million, down 22% year-on-year.
ON Semiconductor CEO stated that it will continue to increase investment in strategic markets and expand product layout relying on analog and mixed-signal solutions.At the same time, it also gave third-quarter performance guidance: revenue range of 1.7 billion to 1.8 billion US dollars, gross profit margin 44.3% to 46.3%.The company has significant advantages in the domestic silicon carbide market and has supplied SiC devices to nearly 60% of domestic pure electric models, helping car companies upgrade to 800V high-voltage platforms.
2. NAND flash memory investment by major storage manufacturers has shrunk, and the industry may now experience a slight oversupply.
Driven by the boom of HBM, the capital expenditure focus of storage original manufacturers is tilted towards DRAM and HBM.Industry data shows that Samsung, SK Hynix and Micron will invest inNAND flash memory capital investment decreases instead of increasing, a significant contraction compared with the previous two years.
Although enterprise storage demand remains strong, NAND supply and demand imbalances remain a concern.In the second half of the year, the production capacity of major original manufacturers will return to normal levels, and agencies predictNAND may experience a slight oversupply in the third quarter, the pace of flash memory quotation increases will also gradually slow down.
3. CAICT: Domestic mobile phone shipments increased by 12.5% year-on-year in June, with a significant recovery in the first half of the year
The latest data from the China Academy of Information and Communications Technology shows that mobile phone shipments in the domestic market in June were 24.912 million units.12.5% year-on-year growth; Among them, 22.131 million 5G mobile phones were shipped, a year-on-year increase of 27.8%, accounting for 88.8%.Domestic brands shipped 22.043 million units, a year-on-year increase of 12.7%, and accounted for 88.5% of the market.
Looking at the first half of the year as a whole, the total domestic mobile phone shipments from January to June were 147 million units, a year-on-year increase of 13.2%; 5G mobile phone shipments were 124 million units, a year-on-year increase of 21.5%, and the industry recovery trend has been established.
4. SK Hynix releases the world’s top GDDR7 video memory
SK Hynix officially launched a new generation of GDDR7 video memory with a base rate of 32Gbps, an increase of more than 60% compared to the previous generation. It can reach up to 40Gbps in extreme environments. A single chip can support more than 1.5TB of data throughput per second, adapting to high-end graphics cards and AI computing power scenarios.
The energy efficiency of the new product has been improved by more than 50% compared to the previous generation. At the same time, through the upgrade of the packaging structure, the heat-dissipating substrate has been increased from four layers to six layers, and is matched with high thermal conductivity epoxy resin material.Thermal resistance reduced by 74% year-on-year, effectively solving the chip heating problem caused by ultra-high-speed transmission, and will be officially mass-produced in the third quarter of this year.
5. Guoxin Technology’s automotive-grade high-performance MCU tape-out test was successful
Suzhou Guoxin Technology officially announced a new generation of high-performance MCU for automotive electronicsCCFC3012PTComplete tape-out and testing.The chip is based on the self-developed PowerPC architecture C*Core CPU core, using 40nm eFlash technology, equipped with 6 main cores + 4 lockstep core architecture, and has a computing power of over 2700DMIPS.
The product supports TSN Ethernet, CANFD, FlexRay and other vehicle interfaces, integrates hardware security modules, and is suitable for smart driving, smart cockpits and highly integrated domain controllers. Its performance can benchmark the Infineon TC397/TC399 series of vehicle-specific MCUs, filling the gap in domestic high-end vehicle control chips.
6. NIO’s 5nm smart driving chip Shenji NX9031 was successfully taped out
At NIO IN 2024 NIO Innovation and Technology Day, NIO officially announcedThe world’s first 5nm car-grade high-end smart driving chip Shenji NX9031The tape-out was successful, and the chip and underlying software were fully self-developed.
The chip integrates more than 50 billion transistors, adopts a 32-core large and small core CPU architecture, is equipped with LPDDR5x memory, and has a speed of 8533Mbps. It has a built-in high-performance ISP, a pixel processing capacity of 6.5G Pixel/s, and a processing delay of less than 5ms. It can meet the computing power and real-time response requirements of high-end autonomous driving in all scenarios. It will be gradually installed in vehicles in the future.
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