[Core Information] Renesas Automotive revenue increases year-on-year, ASE FOPLP will ship next year
1. Renesas’ Q2 automotive business grew rapidly, but overall revenue declined slightly
Renesas announced its second quarter results for 2024, with total revenue of 358.8 billion yen, down 2.7% year-on-year; gross profit margin was 56.7%, down slightly 0.7 percentage points year-on-year; operating profit fell 14.3% year-on-year to 110.6 billion yen.
The performance of different business segments is obviously differentiated:
Automobile business revenue was 190.4 billion yen, a year-on-year increase of 18.2%; Industrial/Infrastructure/IoT business revenue fell 18.9% year-on-year.
Renesas expects third-quarter revenue of 348 billion yen (plus or minus 7.5 billion yen), which is overall lower than the same period last year.
2. ASE’s FOPLP advanced packaging will be officially shipped in the second quarter of next year
The demand for advanced packaging continues to be strong. Following CoWoS,
Panel level fan-out packaging FOPLPBecome the new focus of the industry.
ASE’s Chief Operating Officer revealed that the company’s FOPLP has completed years of joint research and development with customers and equipment manufacturers, with a layout of more than five years, and the process size has expanded from 300×300mm to 600×600mm;
Shipping is expected to begin in the second quarter of 2025, the initial production capacity is small, and the volume will be gradually increased to fill the gap in advanced packaging production capacity.
3. Yole: Advanced packaging to achieve CAGR of 12.9% in 2029
Research firm Yole predicts that global advanced packaging industry revenue will grow from US$39.2 billion in 2023 to US$81.1 billion in 2029.
Compound annual growth rate 12.9%。
Q1 advanced packaging revenue in 2024 will be US$10.2 billion, down 8.1% from the previous quarter; Q2 is expected to rebound 4.6% to US$10.7 billion.The industry is still in the inventory digestion stage, and recovery will be stronger in the second half of the year.
In terms of capital expenditures, leading companies will invest US$9.9 billion in advanced packaging in 2023, a year-on-year decrease of 21%.
Expected to rebound by 20% in 2024。
4. Canalys: Domestic smartphone shipments increased by 10% year-on-year in the second quarter
Canalys data shows that smartphone shipments in mainland China will increase by 10% year-on-year in Q2 2024, with a total volume exceeding 70 million units.
Market structure: vivo topped the list with 19% share, OPPO and Honor ranked second and third, followed closely by Huawei and Xiaomi; Apple's share fell by 2 percentage points year-on-year, ranking down to sixth, and domestic mobile phones as a whole have made a strong recovery.
5. TSMC’s German factory will start construction at the end of the year and is expected to enter mass production in 2027
Supply chain news revealed that TSMC’s 12-inch factory in Germany has finalized the construction, factory and equipment supply chain list.
Construction will officially start in the fourth quarter of 2024。
The factory focuses on 28/22nm and 16/12nm processes, focusing on the automotive and industrial chip markets; it plans to move in equipment in the third quarter of 2026, build a mini production line with a monthly output of 3,000 pieces in the first quarter of 2027, and mass production in the four seasons. In 2028, it will gradually reach the monthly production capacity target of 40,000 pieces.
6. Samsung HBM3 has been certified by NVIDIA and is exclusively for China H20
Samsung HBM3 memory has been certified by NVIDIA. At this stage
Only supply China special version H20 AI chip。
The industry expects that Samsung HBM3E is expected to complete NVIDIA certification in August and start supply in the third quarter; there are still some performance standards to be finalized, and the official has not yet responded to the relevant progress.
7. Sanan Semiconductor’s second phase of silicon carbide is about to be put online, and it will launch mass production of 8-inch SiC
Sanan Semiconductor Chip Factory No. 2 M6B equipment officially enters the market, logo
The second phase of the SiC project enters the countdown to production。
The total investment of the project is 16 billion yuan to create a 6/8-inch compatible silicon carbide full industry chain platform; after reaching production, it will have an annual production capacity of 360,000 6-inch and 480,000 8-inch SiC wafers.It is expected that M6B will be lit up in December this year, and Sanan will transform into a domestic 8-inch SiC vertically integrated core manufacturer.
$1.3/ 个
BOM
+86 4000004090
Online WhatsApp