[Core News] TSMC’s performance growth is strong, DRAM price increase encounters resistance from downstream
1. TSMC’s Q2 revenue increased by 40% year-on-year, with advanced process revenue accounting for 67%
TSMC released its second quarter financial report for 2024, with consolidated revenue of approximately NT$673.51 billion, net profit of NT$247.85 billion, and earnings per share of NT$9.56.
Year-on-year performance: revenue increased significantly by 40.1%, and net profit after tax and earnings per share increased simultaneously by 36.3%;
Quarter-on-quarter performance: revenue increased by 13.6%, and net profit after tax increased by 9.9%.
This quarter's gross profit margin was 53.2%, operating profit margin was 42.5%, and after-tax net profit margin was 36.8%. Profit levels remained high.
Process revenue structure: 3nm accounts for 15%, 5nm accounts for 35%, 7nm accounts for 17%;7nm and above advanced processes account for 67% of total revenue, advanced technology has become the core pillar of performance.
2. DRAM price increases meet downstream resistance, and spot price increases stagnate
Affected by the resistance of end customers, the price increase of DRAM for mobile phones, PCs, and servers has been suspended.
In June, the bulk wholesale price of DDR4 8Gb was about US$2.10, and that of 4Gb was about US$1.62, which was the same as last month. This is the third time that prices have been flat in the past four months.
The long-term contract price of DRAM is negotiated between the original manufacturer and the customer on a monthly/quarterly basis, while the spot price intuitively reflects the real supply and demand. The current spot market is stable, and purchasers are generally resistant to the original manufacturer's price increase demands. It is difficult for DRAM prices to continue to rise in the short term.
3. Texas Instruments releases 6 new power modules, creating the smallest size in the industry
Texas Instruments launches 6 new power modules equipped with self-developedMagPack integrated magnetic packaging technology, compared with competing products, the overall size is reduced by 23%, while improving power density, conversion efficiency and reducing electromagnetic interference.
Among them, TPSM82866A, TPSM82866C and TPSM82816 areIndustry’s smallest 6A power module, achieving an ultra-high power density of nearly 1A per square millimeter; the other three models are TPSM828303, TPSM82813, and TPSM81033, which are suitable for high-end power supply design scenarios in industry, enterprises, and communications.
4. Sirip launches automotive-grade ideal diode controller, which will be available in batches within the year
Sirip officially releasedAutomotive Grade Ideal Diode ORing Controller TPS65R01Q, the typical operating current at room temperature is only 60μA, and the full temperature range does not exceed 100μA, with excellent low power consumption performance.
The product can be used in industrial control, enterprise power supply, automotive host, ADAS, instrument panel, head-up display and other scenarios. It is currently in the small batch production stage.Mass supply is expected to be available in 2024。
5. Changdian Technology: The global semiconductor market will return to growth in 2024
Changdian Technology predicts that the global semiconductor market will end its adjustment cycle and return to the growth track in 2024. The recovery in terminal demand will drive a steady recovery in the utilization rate of packaging and testing factories.
Benefiting from the boom in HPC high-performance computing chips, demand for advanced packaging continues to increase.The company continues to delve into fields such as automotive electronics, 5G communications, high-performance computing, and new generation power devices. Relying on its balanced production capacity layout and diversified customer resources at home and abroad, it has fully benefited from industry recovery and global supply chain restructuring opportunities.