From “Catch-Up” To “Breakout”: China’S Innovation Paradigm Transformation Behind The Breakthrough Of Electron Beam Lithography Machines

1. Xizhi electron beam lithography machine: core breakthrough and technology positioning

• Device location：The first independently developed machine in China100kV electron beam lithography machine
• core accuracy：0.6nm, which can achieve ultra-high-precision direct writing at the nanometer scale
• Technical route：electron beam direct writing, avoiding the complex optical system of EUV lithography machines and taking a differentiated route
• Leading unit: Zhejiang University Quantum Research Institute, unites the University of Science and Technology of China and private enterprises to form an innovation consortium
• Industry driven: Directly drive about5 billion yuanIndustrial scale, indirect benefits exceed20 billion yuan

2. Why take the electron beam route?——Bypassing EUV blockade and realizing lane change and overtaking

1. Not directly benchmarking EUV mass production lines

   EUV focuses on large-scale mass production of advanced logic chips (7nm/3nm), which is extremely difficult and the industrial chain is extremely complex.

   Electron beam is more suitableHigh-end R&D, small batch high-precision chips, the threshold is more controllable.
2. Precise card positioning for the next generation chip track
   • Quantum chip: Etching the qubit insulating barrier layer, the yield is from30% → 65%
   • third generation semiconductor：GaN, SiC, Ga₂O₃ power devices, the yield rate has been increased to85%
   • Photonic chip, biochip: Expand new scenarios for high-precision micro-nano processing
3. Quickly create available production capacity

   First solve the problem of existence and high-precision, and then gradually improve efficiency to achieve the goal ofScientific research equipment→Production line equipmenta gradual breakthrough.

3. Chinese-style innovation paradigm: from single-point research to system collaboration

1. Demand driven, government support

• Hangzhou West Science and Technology Innovation Corridor adopts the mechanism of **enterprises setting questions, universities unveiling lists, and the government accompanying**
• R&D cycle30% shorter, cost40% lower
• Technology transformation efficiency50% improvement, a breakthrough in the localization rate of key equipment40%

2. Industry-university-research innovation consortium

• Universities: Zhejiang University and the University of Science and Technology of China are responsible for core underlying technologies such as electronic optics, algorithms, and magnetic field shielding.
• Enterprise: Responsible for engineering, mass production, and market implementation
• Government: Build platforms, open up chains, and share risks

3. Equipment - materials - ecological breakthrough simultaneously

• withCSSC Special AirJoint research: NF₃, WF₆ and other electronic special gases realize domestic substitution
• Global market share increased from5% → 10%
• Cooperate with domestic nanoimprint equipment to form a **R&D + mass production** technology closed loop

4. Current shortcomings and future directions

1. Main bottlenecks

• Mass production efficiency is low: The electron beam direct writing speed is about EUV1/10, not suitable for large-scale tape-out at the moment
• Some materials rely on imports: There are still gaps in high-purity electronic gas, special silicon wafers, and high-precision components.
• Quantum effect error: High-energy electron beam scattering and energy fluctuations affect atomic-level accuracy and stability

2. Next technical path

• advanceMultiple electron beam parallel scanning, greatly increasing the throughput
• useAI algorithm optimizationBeam control, error compensation
• perfectEquipment — materials — design — packaging and testingFull chain collaboration
• Expand toOptical chips, micro-nano electromechanical, biochipsWait for new areas

5. Industrial Significance: From Chaser to Ruler Participant

1. Break the equipment jam

   Realized for the first time in the field of high-end lithographyHigh-precision independent equipmentAvailable, no longer completely locked externally.
2. Reconstruct innovation logic

   From introduction — digestion — absorption

   → turnIndependently defined routes + differentiated breakthroughs + ecological co-construction。
3. Seize future industry standards

   Quantum chips, third-generation semiconductors, and photonic chips are still in their early stages.

   China is expected to move from technological breakthrough to standard setting.

Summary