[Core Information] SMIC’s revenue increased by more than 20% year-on-year, and its capacity utilization rate increased
1. SMIC’s revenue increased by more than 20% year-on-year, and its capacity utilization rate increased simultaneously.
Wafer foundry SMIC announced its second quarter results for 2024. Revenue for the period reached US$1.9013 billion, a year-on-year increase of 21.8%, and a month-on-month increase of 8.6%; gross profit margin was 13.9%, a year-on-year decrease of 6.4 percentage points, and a slight increase of 0.2 percentage points month-on-month; the current profit was US$172 million, a year-on-year decrease of 62.9%, and a month-on-month increase of 171.2%.
During the current period, SMIC's capacity utilization rate reached 85.2%, achieving year-on-year and month-on-month growth; wafer sales amounted to more than 2.11 million 8-inch wafers, a year-on-year increase of 50.5%, and a month-on-month increase of 17.7%.Looking forward to the third quarter, SMIC expects quarterly revenue to increase by 13%-15% sequentially, with gross profit margin remaining in the 18%-20% range.
2. Avnet announces fourth quarter and full-year financial results for fiscal year 2024
Distribution company Avnet disclosed results for the fourth quarter of fiscal 2024 (ending June 29) and full year.Fourth-quarter revenue was $5.6 billion, down 15.1% year-on-year and 1.6% quarter-on-quarter; operating profit was $164 million, down 42.1% year-on-year and 13.7% quarter-on-quarter.
For the whole year, Avnet's fiscal year 2024 revenue was US$23.8 billion, down from US$26.5 billion the previous year; operating profit was US$844 million, down from US$1.187 billion the previous year.Inventories at the end of the fiscal year were US$5.47 billion, basically the same as the end of the previous year, and there was no significant change in inventory pressure.
3. Infineon officially launched its silicon carbide device factory in Kulim, Malaysia
Infineon announced the official opening of the first phase of its 8-inch silicon carbide (SiC) power semiconductor plant in Kulim, Malaysia.The investment in this stage amounts to 2 billion euros, mainly focusing on the production of silicon carbide power semiconductors, and also covering the gallium nitride (GaN) epitaxy business.
The factory will be deeply linked with Infineon's Global Power Semiconductor Competence Center in Villach, Austria. The two parties will share technology and processes to achieve rapid ramp-up of production capacity and efficient and smooth operation, improve the elasticity and flexibility of the supply chain, and ultimately benefit global customers.Infineon has previously increased SiC and GaN power semiconductor production capacity at the Villach site in 2023.
4. TSMC releases CoW packaging outsourcing orders to ease production capacity constraints
According to related news, TSMC has outsourced the CoW step foundry order for CoWoS packaging for the first time, and Silicon Products successfully won it.Silicon Products will invest in the construction of relevant production capacity at the Zhongke Factory. It is expected to complete the installation of machines in the second quarter of 2025 and achieve mass production in the third quarter.The process commissioned this time comes from CoWoS-S, which uses high-performance, high-cost silicon interposers.
CoWoS packaging is mainly divided into two steps: CoW and WoS. The CoW step has a more complex process and is more profitable, while the WoS step is relatively simple and low-profit.TSMC has previously entrusted some WoS processes to OSAT companies. This expansion to the CoW stage is mainly to alleviate the pressure of continued short supply of CoWoS packaging production capacity.
5. Intel’s 18A process products were successfully launched, and the first foundry customer will tape out next year
Intel officially announced that its 18A (1.8nm level) process, Panther Lake Core processors, and Clearwater Forest Xeon processors have been successfully lit and successfully entered the operating system.Among them, the memory equipped with Panther Lake can run stably at the set frequency, showing healthy performance.
It is reported that it is less than two quarters since the first tape-out of the two processors, and both are scheduled to be released on time in the first half of next year.At the same time, the first external foundry customer of Intel's 18A process will complete tape-out in the first half of next year, marking the gradual move towards commercial application of this advanced process.
6. SK Hynix CEO: Memory demand will remain strong until early next year
SK Hynix CEO Guo Luzheng said that driven by strong demand for high-performance memory chips such as HBM, the memory chip market will maintain an optimistic trend and is expected to remain active until early next year.
SK Hynix believes that as the AI market continues to expand, memory demand will continue to grow next year and has formulated active strategies to respond.The company plans to supply 12-layer HBM3E samples to major customers this quarter and start mass production. In the second half of next year, it will launch 12-layer HBM4 products developed in cooperation with TSMC to further seize the AI memory market share.
7. IDC predicts: the global automotive core market will exceed US$88 billion in 2027
With the rapid popularization of advanced driving assistance systems, electric vehicles and the Internet of Vehicles, the market's demand for semiconductors such as high-performance computing chips, image processing units, radar chips and lidar sensors is growing, bringing new growth opportunities to the automotive semiconductor industry.
IDC predicts that the global automotive semiconductor market will exceed US$88 billion by 2027.As the value of bicycle semiconductors continues to increase, the attention and importance of semiconductor companies in the automotive industry chain will be further highlighted.
8. Microchip launches high-performance SSD controller for AI and enterprise applications
Microchip recently released the Flashtec NVMe 5016 SSD controller, which is a 16-channel PCIe Gen 5 NVM Express specification. It focuses on high bandwidth, high security and high flexibility, and is specially designed for enterprise applications and AI scenarios.
The controller can support latency- and performance-sensitive enterprise applications such as online transaction processing, financial data processing, and database mining. It can also meet the needs of the AI field with high throughput, efficiently handle large data sets in model training and inference, and provide the high bandwidth required to quickly move large amounts of data.Its sequential read performance exceeds 14 GB per second, leveraging compute resources in traditional and AI-accelerated servers under demanding workloads.
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