[Core News] Infineon’s revenue drops and layoffs, TSMC is rumored to raise prices for 5/3 nanometers
1. Infineon’s quarterly revenue fell 9% and it launched a global layoff plan
Infineon announced its third quarter results for fiscal year 2024. Quarterly revenue fell 9% year-on-year, net profit plummeted 52% year-on-year, and profit margin dropped to 19.5%, down 6.6 percentage points year-on-year.
To advance cost-saving plans, Infineon announces
1,400 layoffs worldwide, and another 1,400 positions will be relocated to areas with lower labor costs, including hundreds of positions at the Regensburg factory in Germany.
Corporate executives said that the recovery of the new energy vehicle market is less than expected and the time for a full recovery is still unclear; the company has twice lowered its annual revenue guidance, which currently remains at around 15.1 billion euros, with a floating range of 400 million euros.
2. It is rumored that TSMC will increase the price of its 5/3 nanometer process by another 3%-8% next year.
Industry sources revealed that TSMC has informed customers of price increases in 2024
In 2025, the price of 5nm and 3nm processes will be raised again by 3%-8%。
Affected by the rising costs of factory construction and process research and development, TSMC has stabilized its high gross profit margin level of 53% through price increases and appropriately passed on the cost pressure to customers.
At present, TSMC's HPC and AI chip orders continue to be hot, and consumer electronics has entered the peak season. Apple, Qualcomm, MediaTek, Nvidia, AMD and other large orders are sufficient, and the 5/3 nanometer production capacity has been fully loaded for a long time. The company has simultaneously expanded production to cope with strong demand.
3. SIA: Global semiconductor sales surged 18.3% year-on-year in the second quarter
According to data from the U.S. Semiconductor Industry Association SIA, global semiconductor sales reached US$149.9 billion in the second quarter of 2024.
A year-on-year increase of 18.3% and a month-on-month increase of 6.5%; Monthly sales in June were US$50 billion, a month-on-month increase of 1.7%.
From a regional perspective: China and the Asia-Pacific markets grew steadily year-on-year, while the Americas grew simultaneously; Japanese and European markets declined year-on-year.The month-on-month performance in June was differentiated, with the Americas, Japan, and China achieving positive growth, while Europe and other Asia-Pacific regions fell slightly.
4. Innolux panel-level packaging will be mass-produced by the end of the year, and the panel boom will bottom out in the second half of the year
Innolux disclosed the progress of panel level packaging (FOPLP) at the conference: Chip-first process
Mass production by the end of this year, contribute revenue early next year; wire redistribution layer RDL is planned to be mass-produced in 1-2 years; through-glass hole TGV packaging is expected to be launched in 2-3 years.
Panel industry boom expectations
Bottoming out in the second half of the year and picking up in the first half of next year, factory utilization rate will be slightly adjusted by about 5% in the third quarter.
Innolux's layout of FOPLP aims to cut into the AI PC industry chain, gradually evolving from small and medium-sized die I/O to high-end large-size die, and at the same time, it has established technical confidence in the high-threshold TGV drilling process.
5. Samsung mass-produces the thinnest LPDDR5 package to adapt to mobile AI scenarios
Samsung has officially launched the industry’s thinnest 12nm-class 12GB/16GB LPDDR5X memory package, with a thickness of only 0.65mm. It is about 9% thinner than the previous generation and has a 21.2% improvement in heat resistance. It is specially designed for
Mobile AI terminaldesign.
By optimizing the PCB and epoxy plastic sealing materials and improving the overlapping process, the industry's thinnest specifications for products with the same capacity have been achieved. In the future, 6-layer 24GB and 8-layer 36GB ultra-thin versions will be developed to meet the high-density and small-size storage needs of high-end mobile devices.
6. The demand for recycled wafers is picking up, and orders from major manufacturers have surged and they plan to make additional investments.
RS Technologies, a major recycled wafer manufacturer, revealed that orders from Japanese original manufacturers will shrink significantly in 2023, and orders will pick up month by month in 2024, with a monthly increase of 10,000-20,000 pieces.
The combined monthly production capacity of factories in Japan and Taiwan is expected to expand to 580,000 pieces in 2024 from 540,000 pieces last year; among them, the Japanese factory is fully loaded with three shifts 24 hours a day and is still in short supply, and plans to add new equipment
Expand production to another 170,000 pieces/month, to undertake downstream recovery needs.
7. The entry of foreign garbage is strictly prohibited, and Fuzhou Customs seized 35 kilograms of used mobile phone parts
Customs at Fuzhou Changle Airport seized a large number of used mobile phone cameras, screens and other parts in the luggage of inbound passengers, with a total weight of 35.27 kilograms.
Such waste electronic parts are prohibited from entry into my country
foreign garbage, it has been disposed of in accordance with laws and regulations, and the solid waste entry supervision line of defense is strictly observed.
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